The effect of thermal contact resistance on heat management in the electronic packaging-Reference-Cited by-同舟云学术

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The effect of thermal contact resistance on heat management in the electronic packaging

Published:2005-06 Issue:1-3 Volume:246 Page:290-302
ISSN:0169-4332
Container-title:Applied Surface Science
language:en
Short-container-title:Applied Surface Science

Author:

Grujicic M.,Zhao C.L.,Dusel E.C.

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Surfaces and Interfaces,General Physics and Astronomy,General Chemistry

Reference16 articles.

1. Review of thermal joint resistance models for non-conforming rough surfaces in a vacuum;Bahrami,2003

2. Thermal management of electronics systems – II;Beyne,1995

3. FEMLAB 3.0a, COMSOL Inc., Burlington, MA, 2004. http://www.comsol.com.

4. The Language of Technical Computing, MATLAB,2003

5. Design and optimization of polymer electrolyte membrane (PEM) fuel cells;Grujicic;Appl. Surf. Sci.,2004

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