Numerical analysis of ultrasonic wire bonding: Effects of bonding parameters on contact pressure and frictional energy-Reference-Cited by-同舟云学术

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Numerical analysis of ultrasonic wire bonding: Effects of bonding parameters on contact pressure and frictional energy

Published:2006-01 Issue:1-2 Volume:38 Page:11-24
ISSN:0167-6636
Container-title:Mechanics of Materials
language:en
Short-container-title:Mechanics of Materials

Author:

Ding Yong,Kim Jang-Kyo,Tong Pin

Publisher

Elsevier BV

Subject

Mechanics of Materials,General Materials Science,Instrumentation

Reference30 articles.

1. Specifying surface quality—a method based on accurate measurement and comparison;Abbott;Mech. Eng.,1933

2. Temperature maps for frictional heating in dry sliding;Ashby;Tribol. Trans.,1991

3. ASM Handbook;ASM International Handbook Committee,1990

4. Material Science and Engineering: An Introduction;Callister,2003

5. Process windows for low temperature Au wire bonding;Chan;J. Electron. Mater.,2004

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