Nonlinear thermo-elastic analysis of edge dislocations with Internal Heat Generation in Semiconductor Materials
Author:
Publisher
Elsevier BV
Subject
Mechanics of Materials,General Materials Science,Instrumentation
Reference65 articles.
1. A finite element method to simulate dislocation stress: a general numerical solution for inclusion problems;Ahn;AIP Adv.,2020
2. Computational Methods in Elasticity and Plasticity: Solids and Porous Media;Anandarajah,2011
3. Higher-order nonlinear electromechanical effects in wurtzite GaN/AlN quantum dots;Bahrami-Samani;J. Phys. Condens. Matter,2010
4. The thermally enhanced diffusion of point defects near dislocations during device operation;Basson;J. Appl. Phys.,1979
5. Finite element analysis of discrete edge dislocations: configurational forces and conserved integrals;Baxevanakis;Int. J. Solid Struct.,2015
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