A computational damage mechanics model for thermomigration-Reference-Cited by-同舟云学术

A computational damage mechanics model for thermomigration

Published:2009-03 Issue:3 Volume:41 Page:271-278
ISSN:0167-6636
Container-title:Mechanics of Materials
language:en
Short-container-title:Mechanics of Materials

Author:

Li Shidong,Basaran Cemal

Publisher

Elsevier BV

Subject

Mechanics of Materials,General Materials Science,Instrumentation

Reference31 articles.

1. Abdulhamid, M., Basaran, C., in press. Influence of Thermomigration on Lead-Free Solder Joint Mechanical Properties. ASME Journal of Electronic Packaging.

2. Equilibrium Vacancy Concentration Measurements on Tin Single Crystals;Balzer;Physica Status Solidi B: Basic Research,1979

3. An irreversible thermodynamics theory for damage mechanics of solids;Basaran;International Journal of Damage Mechanics,2004

4. A thermodynamic framework for damage mechanics of solder joints;Basaran;Journal of Electronic Packaging, Transactions of the ASME,1998

5. Mesh sensitivity and Fea for multi-layered electronic packaging;Basaran;Journal of Electronic Packaging,2001

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