Publisher
Springer International Publishing
Reference118 articles.
1. Amiri, M., & Khonsari, M. M. (2012). On the role of entropy generation in processes involving fatigue. Entropy, 14(1), 24–31.
2. Basaran, C., & Chandaroy, R. (2002). Thermomechanical analysis of solder joints under thermal and vibrational loading. Transactions of the ASME: Journal of Electronic Packaging, 124(1), 60–67.
3. Basaran, C., & Lin, M. (2007a). Electromigration induced strain field simulations for nanoelectronics lead-free solder joints. International Journal of Solids and Structures, 44, 4909–4924.
4. Basaran, C., & Lin, M. (2007b). Damage mechanics of electromigration in microelectronics copper interconnects. International Journal of Materials and Structural Integrity, 1(1/2/3), 16–39.
5. Basaran, C., & Lin, M. (2008). Damage mechanics of electromigration induced failure. Mechanics of Materials, 40, 66–79.