Characterization and constitutive modeling of stress-relaxation behavior of Poly(methyl methacrylate) (PMMA) across the glass transition temperature
Author:
Funder
NSF CMMI
Publisher
Elsevier BV
Subject
Mechanics of Materials,General Materials Science,Instrumentation
Reference27 articles.
1. Hot embossing of pyramidal micro-structures in PMMA for cell culture;Schneider;Phys. Status Solidi A,2009
2. Finite element modeling of polymer hot embossing using a glass-rubber finite strain constitutive model;Dupaix;Polym. Eng. Sci.,2009
3. Embossing of high-aspect-ratio-microstructures using sacrificial templates and fast surface heating;Lu;Polym. Eng. Sci.,2007
4. Polymer embossing tools for rapid prototyping of plastic microfluidic devices;Narasimhan;J. Micromech. Microeng.,2004
5. Large strain mechanical behavior of poIy(methyl methacrylate) (PMMA) near the glass transition temperature;Palm;J. Eng. Mater. Technol.,2006
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