Author:
Shukla S.,Yadav N.,Lochab B.
Reference61 articles.
1. Development of new class of electronic packaging materials based on ternary systems of benzoxazine, epoxy, and phenolic resins;Rimdusit;Polymer,2000
2. (b) S.L. Lehmann, W.H. Li, R.S. Wong, Curable compositions for advanced processes, and products made therefrom, US 7709579 B2, (2010).
3. Development of a DOPO-containing benzoxazine and its high-performance flame retardant copolybenzoxazines;Spontón;Polym. Degrad. Stab.,2009
4. Polybenzoxazines—new high performance thermosetting resins: synthesis and properties;Kiskan;Prog. Polym. Sci.,2007
5. http://www.efsa.europa.eu/en/topics/topic/bisphenol.htm.
Cited by
20 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献