Development of new class of electronic packaging materials based on ternary systems of benzoxazine, epoxy, and phenolic resins
Author:
Publisher
Elsevier BV
Subject
Polymers and Plastics,Materials Chemistry,Organic Chemistry
Reference44 articles.
1. Advances in polymer science 84;Wong,1988
2. Advances in polymer science 88;Kinjo,1989
3. Recent Development of Advanced Functional Polymers for Semiconductor Encapsulants of Integrated Circuit Chips and High-temperature Photoresist for Electronic Applications
4. Plastic packaging of microelectronic devices;Manzione,1990
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