Development of new class of electronic packaging materials based on ternary systems of benzoxazine, epoxy, and phenolic resins-Reference-Cited by-同舟云学术

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Development of new class of electronic packaging materials based on ternary systems of benzoxazine, epoxy, and phenolic resins

Published:2000-10 Issue:22 Volume:41 Page:7941-7949
ISSN:0032-3861
Container-title:Polymer
language:en
Short-container-title:Polymer

Author:

Rimdusit S,Ishida H

Publisher

Elsevier BV

Subject

Polymers and Plastics,Materials Chemistry,Organic Chemistry

Reference44 articles.

1. Advances in polymer science 84;Wong,1988

2. Advances in polymer science 88;Kinjo,1989

3. Recent Development of Advanced Functional Polymers for Semiconductor Encapsulants of Integrated Circuit Chips and High-temperature Photoresist for Electronic Applications

4. Plastic packaging of microelectronic devices;Manzione,1990

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