The activation energy for electromigration and grain-boundary self-diffusion in gold
Author:
Publisher
Elsevier BV
Subject
General Engineering
Reference5 articles.
1. Nature and Behavior of Grain Boundaries;d'Heurle,1972
2. J. F. Ziegler, J. E. E. Baglin and A. Gangulee, unpublished work.
3. Electromigration in thin gold films
4. Electromigration‐Induced Failures in, and Microstructure and Resistivity of, Sputtered Gold Films
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