Author:
Nimmagadda Rajesh,Venkatasubbaiah K.
Subject
General Physics and Astronomy,Mathematical Physics
Reference32 articles.
1. High performance heat sinking for VLSI;Tuckerman;IEEE Electron Device Lett.,1981
2. S.A. Solovitz, L.D. Stevanovic, R.A. Beaupre, Micro channel thermal management of high power devices, in: Applied Power Electronics Conference and Exposition, APEC ’06, Dallas, TX, 2006, 885–891.
3. A practical implementation of silicon microchannel coolers for high power chips;Colgan;IEEE Trans. Components Packag. Technol.,2007
4. Low temperature two phase microchannel cooling for high heat flux thermal management of defense electronics;Lee;IEEE Trans. Components Packag. Technol.,2009
5. Tushara Pasupuleti, Satish G. Kandlikar, Cooling of microelectronic devices packaged in a single chip module using single phase refrigerant R-123, in: Proceedings of the ASME 2009 7th International Conference on Nanochannels, Microchannels and Minichannels, ICNMM2009, Pohang, South Korea, 2009, pp. 1–5.
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