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Extended displacement discontinuity method for analysis of penny-shaped cracks in three-dimensional thermal piezoelectric semiconductors

  • Published:2018-07 Issue: Volume:70 Page:23-36
  • ISSN:0997-7538
  • Container-title:European Journal of Mechanics - A/Solids
  • language:en
  • Short-container-title:European Journal of Mechanics - A/Solids

Author:

Zhao MingHao,Yang ChangHai,Fan CuiYing,Xu GuangTao

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

General Physics and Astronomy,Mechanical Engineering,Mechanics of Materials,General Materials Science

Cited by 17 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Fracture Analysis of Planar Cracks in 3D Thermal Piezoelectric Semiconductors;International Journal of Mechanical Sciences;2024-07

2. Transient Responses of a Mode-III Crack in a Piezoelectric Semiconductor Material;2023 17th Symposium on Piezoelectricity, Acoustic Waves, and Device Applications (SPAWDA);2023-11-10

3. Size effect in piezoelectric semiconductor nanostructures;Journal of Intelligent Material Systems and Structures;2021-10-26

4. Analysis of a penny-shaped crack with semi-permeable boundary conditions across crack face in a 3D thermal piezoelectric semiconductor;Engineering Analysis with Boundary Elements;2021-10

5. Analysis of Flexural Vibrations of a Piezoelectric Semiconductor Nanoplate Driven by a Time-Harmonic Force;Materials;2021-07-14
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