Effect of Coefficient of Thermal Expansion (CTE) Mismatch of Solder Joint Materials in Photovoltaic (PV) Modules Operating in Elevated Temperature Climate on the Joint's Damage

Author:

Ogbomo Osarumen O.,Amalu Emeka H.,Ekere N.N.,Olagbegi P.O.

Publisher

Elsevier BV

Subject

Artificial Intelligence,Industrial and Manufacturing Engineering

Cited by 24 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Revolutionizing Industries;Advances in Logistics, Operations, and Management Science;2024-05-03

2. Solder joints on thick printed copper substrates;Power Electronic Devices and Components;2024-04

3. Measuring coefficient of thermal expansion of materials of micrometre size using SEM/FIB microscope with in situ MEMS heating stage;Journal of Microscopy;2024-03-14

4. In-situ synchrotron x-ray diffraction and thermal expansion of TiB2 up to ∼3050 °C;Journal of the European Ceramic Society;2023-07

5. Advanced Encapsulants for Reduced Thermal Mechanical Stress in Photovoltaic Modules: A Quantitative Analysis Using FBGS;2023 IEEE 50th Photovoltaic Specialists Conference (PVSC);2023-06-11

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