1. "Modeling and optimization of stencil printing operations: A comparison study";Tsai;Computers & Industrial Engineering,2008
2. Hwang, Jennie S. Solder paste in electronics packaging: technology and applications in surface mount, hybrid circuits, and component assembly. Springer Science & Business Media, 2012
3. Pekka Nummenpää, and Aulis Tuominen. "The effect of lead-free solder paste on component placement accuracy and self-alignment during reflow.";Liukkonen;Soldering & surface mount technology,2004
4. Hwang, Jennie S. Solder paste in electronics packaging: technology and applications in surface mount, hybrid circuits, and component assembly. Springer Science & Business Media, 2012.
5. "Flow processes in solder paste during stencil printing for SMT assembly";Mannan;Journal of Materials Science: Materials in Electronics,1995