The effect of lead‐free solder paste on component placement accuracy and self‐alignment during reflow-Reference-Cited by-同舟云学术

The effect of lead‐free solder paste on component placement accuracy and self‐alignment during reflow

Published:2004-04 Issue:1 Volume:16 Page:44-47
ISSN:0954-0911
Container-title:Soldering & Surface Mount Technology
language:en
Short-container-title:Soldering & Surface Mount Tech

Author:

Liukkonen Timo,Nummenpää Pekka,Tuominen Aulis

Publisher

Emerald

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science,Electrical and Electronic Engineering,Condensed Matter Physics,General Materials Science

Reference16 articles.

1. Abtew, M. and Selvaduray, G. (1998), “Lead‐free solders for surface mount technology applications”,Chip Scale Review, Vol. 2 No. 4, pp. 29‐38.

2. Ainsworth, P.A. (1986), “Measurement of tackiness of solder paste”,Hybrid Circuits, No. 11, pp. 27‐30.

3. Determination of Parameters Affecting Solder Paste Tack Strength as Measured in the IPC Tack Test: A Classical Design of Experiments Approach

4. Diepstraten, G. (2002), “5 steps to success in lead‐free soldering ‐‐ step 4: implement lead‐free manufacturing”,Electronic Production, Vol. 31 No. 7, pp. 7‐11.

5. Solder pastes tackiness: the influences of the process atmosphere and of the test method

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