Statistical Analysis for Component Shift in Pick and Place Process of Surface Mount Technology-Reference-Cited by-同舟云学术

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Statistical Analysis for Component Shift in Pick and Place Process of Surface Mount Technology

Published:2019 Issue: Volume:38 Page:217-224
ISSN:2351-9789
Container-title:Procedia Manufacturing
language:en
Short-container-title:Procedia Manufacturing

Author:

Cao Shun,Parviziomran Irandokht,Park Seungbae,Won Daehan

Publisher

Elsevier BV

Subject

Artificial Intelligence,Industrial and Manufacturing Engineering

Reference5 articles.

1. "Modeling and optimization of stencil printing operations: A comparison study";Tsai;Computers & Industrial Engineering,2008

2. Solder paste in electronics packaging: technology and applications in surface mount, hybrid circuits, and component assembly;Hwang,2012

3. "The effect of lead-free solder paste on component placement accuracy and self-alignment during reflow";Liukkonen;Soldering & surface mount technology,2004

4. Reflow Soldering Processes;Lee,2002

5. Regression analysis and linear models: Concepts, applications, and implementation;Darlington;Guilford Publications,2016

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A multimodal fusion method for soldering quality online inspection;Journal of Intelligent Manufacturing;2024-05-14

2. Analysis on the Component Movement in Electronic Assembly;2021 8th International Forum on Electrical Engineering and Automation (IFEEA);2021-09

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