Solid-State Interfacial Reaction between Eutectic Au−Ge Solder and Cu/Ni(P)/Au Metalized Ceramic Substrate and Its Suppression-Reference-Cited by-同舟云学术

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Solid-State Interfacial Reaction between Eutectic Au−Ge Solder and Cu/Ni(P)/Au Metalized Ceramic Substrate and Its Suppression

Published:2015-05 Issue:5 Volume:31 Page:445-452
ISSN:1005-0302
Container-title:Journal of Materials Science & Technology
language:en
Short-container-title:Journal of Materials Science & Technology

Author:

Lang F.Q.,Yamaguchi H.,Nakagawa H.,Sato H.

Funder

New Energy and Industrial Technology Development Organization

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Polymers and Plastics,Mechanical Engineering,Mechanics of Materials,Ceramics and Composites

Reference31 articles.

1. SiC versus Si—Evaluation of Potentials for Performance Improvement of Inverter and DC–DC Converter Systems by SiC Power Semiconductors

2. Silicon Carbide Power Transistors: A New Era in Power Electronics Is Initiated

3. Development of Advanced All-SiC Power Modules

4. State of the art of high temperature power electronics

5. A Compact 5-nH One-Phase-Leg SiC Power Module for a 600V-60A-40W/cc Inverter

Cited by 15 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Transient liquid phase infiltration bonding of copper using porous silver insert sheet;Journal of Materials Science: Materials in Electronics;2023-07

2. Enhancing the shear strength of the Au–Ge solder joint via forming a ductile face-centered cubic solid solution layer at the interface;Journal of Materials Research and Technology;2022-07

3. Rapid fabrication of Cu/40-μm thick full Cu3Sn/Cu joints by applying pulsed high frequency electromagnetic field for high power electronics;Materials Chemistry and Physics;2022-01

4. Effects of Extreme Thermal Shock on Microstructure and Mechanical Properties of Au-12Ge/Au/Ni/Cu Solder Joint;Metals;2020-10-15

5. Effects of isothermal aging on interfacial microstructure evolution and shear behavior of Au-12Ge/Ni(P)/Kovar Solder Joints;Intermetallics;2020-09

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