A supersaturated Cu-Ag nanoalloy joint with ultrahigh shear strength and ultrafine nanoprecipitates for power electronic packaging
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Polymers and Plastics,Mechanical Engineering,Mechanics of Materials,Ceramics and Composites
Reference44 articles.
1. Fundamentals of power electronics;Erickson,2001
2. An Overview of Artificial Intelligence Applications for Power Electronics
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