Surface oxidation of copper observed by perturbed angular correlation and Rutherford backscattering

Author:

Uhrmacher M,Bartos A,Bolse W

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Cited by 10 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Enhancement of Oxidation Resistance and Electrical Properties of Indium-Doped Copper Thin Films;Journal of Electronic Materials;2008-02-21

2. Chemical and thermal reduction of thin films of copper (II) oxide and copper (I) oxide;Journal of Applied Physics;2001-10-15

3. Enhancement of oxidation resistance in Cu and Cu(Al) thin layers;Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms;1999-01

4. Investigation of the mechanism responsible for the corrosion resistance of B implanted copper;Nuclear Instruments and Methods in Physics Research Section B: Beam Interactions with Materials and Atoms;1994-03

5. Perturbed-angular-correlation experiments withIn111inMBa2Cu3O7−δ(M=Y,Yb): The Cu(1)-site puzzle;Physical Review B;1993-09-01

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