Automated placement of testing pads for electron-beam observation-Reference-Cited by-同舟云学术

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Automated placement of testing pads for electron-beam observation

Published:1997-10 Issue:10-11 Volume:37 Page:1565-1568
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Kuji Norio,Takeda Tadao

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference4 articles.

1. A new VLSI Diagnosis Technique: Focused Ion Beam Assisted Multi-Level Circuit Probing;Mashiko,1987

2. RIE for Failure Analysis;Matusiewicz,1989

3. LSI Applications of 0.25-um CMOS/SIMOX Technology;Ino,1996

4. Local Field Effects on Voltage Measurements in the SEM;Fujioka,1981

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Current status of failure analysis for ULSIs© 1997 IEEE. Reprinted with permission, from Proc. 1997 21st International Conference on Microelectronics, Nis, Yugoslavia, 14–17 September 1997, Vol. 2, pp. 591–598.;Microelectronics Reliability;1998-09

2. Characterization of semiconductor devices by infrared laser interferometry;e & i Elektrotechnik und Informationstechnik;1998-07

3. Application of layout overlay for failure analysis;Microelectronics Reliability;1998-06

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