Author:
Atanassova E.,Paskaleva A.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference91 articles.
1. Detailed measurements and simplified modeling of wafer charging in different barrel reactor configurations;Namura;J. Vac. Sci. Technol.,1991
2. Plasma charging damage: a physical model;Cheung;J. Appl. Phys.,1994
3. A model and experiments for thin oxide damage from wafer charging in magnetron plasmas;Fang;IEEE Electron. Dev. Lett.,1992
4. Kuypers AD. In: High flux reactive ion etching in a magnetic multipole reactor. Amsterdam, 1989.
5. How plasma etching damages thin gate oxides;Gabriel;Solid-State Technol.,1992
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