Thermal management of power electronics modules packaged by a stacked-plate technique-Reference-Cited by-同舟云学术

Thermal management of power electronics modules packaged by a stacked-plate technique

Published:1999-09 Issue:9 Volume:39 Page:1343-1349
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Haque Shatil,Stinnett William A.,Nelson Douglas J.,Lu Guo-Quan

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference8 articles.

1. Extraction of parasitics within wire-bond IGBT modules;Xing,1997

2. High frequency, low cost, power packaging using the thin film power overlay technology;Fisher,1995

3. Stud bump bonding technique for high density multichip modules;Bessho,1993

4. Pressure contact assembly technology of high power devices;Matsuda,1977

5. Thermal management of high-power electronics modules packaged with interconnected parallel plates;Haque,1998

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