Enhancing IC repairs by combining laser direct-writing of Cu and FIB techniques-Reference-Cited by-同舟云学术

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Enhancing IC repairs by combining laser direct-writing of Cu and FIB techniques

Published:1999-06 Issue:6-7 Volume:39 Page:997-1001
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Remes J.,Moilanen H.,Leppävuori S.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference8 articles.

1. How to prepare golden devices using lesser materials;Van Doorselaer,1993

2. Maskless InP wire formation on planar GaAs substrates;Ahopelto;Applied Physics Letters,1994

3. VLSI Electronics: Microstructure Science;Ehrlich,1983

4. Laserassisted chemical vapor deposition of nickel and laser cutting in integrated circuit restructuring;Remes;Physica Scripta.,1997

5. Low resistivity LCVD direct write Cu conductor lines for IC customisation;Moilanen;Physica Scripta.,1997

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Reaction Mechanisms in Laser-Assisted Chemical Vapor Deposition of Microstructures;Chemical Physics of Thin Film Deposition Processes for Micro- and Nano-Technologies;2002

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