Low resistivity LCVD direct write Cu conductor lines for IC customisation
Author:
Publisher
IOP Publishing
Subject
Condensed Matter Physics,Mathematical Physics,Atomic and Molecular Physics, and Optics
Link
http://stacks.iop.org/1402-4896/1997/i=T69/a=049/pdf
Reference11 articles.
1. Copper chemical vapor deposition from Cu(hexafluoroacetylacetonate)trimethylvinylsilane
2. Film Growth Kinetics of Chemical Vapor Deposition of Copper from Cu ( HFA ) 2
3. Copper CVD chemistry on a reactive substrate: bis(hexafluoroacetylacetonato)copper and hfacH on platinum (111)
4. Combined experimental and modeling studies of laser‐assisted chemical vapor deposition of copper from copper(I)‐hexafluoroacetylacetonate trimethylvinylsilane
5. Excimer laser-induced metallization for Si and GaAs microelectronics
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