Failure criteria of flip chip joints during accelerated testing-Reference-Cited by-同舟云学术

Failure criteria of flip chip joints during accelerated testing

Published:2002-12 Issue:12 Volume:42 Page:1921-1930
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Stepniak Frank

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference18 articles.

1. Area array packaging handbook;Gilleo,2002

2. http://www.aecouncil.com

3. Witty MR, Sellers RL, Rosson JM, Walker GG, Meehan MP, Vadas RL, Ward DK. Flip chip assembly on rigid organic laminates. Proc. Int. Conf. Multichip Modules, MCM 98, April 1998

4. http://www.delphi.com/automotive/microelectronics/testdie

5. Conversion of the UBM into intermetallics: the impact on flip chip reliability;Stepniak;Microelectron. Reliab.,2001

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