Charged device model metrology: limitations and problems

Author:

Henry Leo G.,Barth Jon,Hyatt Hugh,Diep Tom,Stevens Michael

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference17 articles.

1. A model for the failure of bipolar silicon integrated circuits subjected to electrostatic discharge;Speakman,1974

2. Bossard PR, Chemelli RG, Unger BA. ESD damage from triboelectrically charged IC pins. EOS/ESD Symposium Proceedings, San Diego, EOS-2, 1980. p. 17–22

3. Renninger RG, Jon MC, Lin DL, Lin L, Diep T, Welsher TL. A field-induced charged device model simulator. EOS/ESD Symposium Proceedings, New Orleans, EOS-11, 1989. p. 59–71

4. Hall K. Tests with different IEC801.2 ESD simulators have different results. EOS/ESD Symposium Proceedings, Las Vegas, EOS-16, 1994. p. 161–163

5. Pommerenke D. Transient Fields of ESD. EOS/ESD Symposium Proceedings, Las Vegas, EOS-16, 1994. p. 150–159

Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Failures of ICs Caused by Dielectric Breakdown;The Herald of the Siberian State University of Telecommunications and Information Science;2023-04-02

2. Investigation on Board-Level CDM ESD Issue in IC Products;IEEE Transactions on Device and Materials Reliability;2008-12

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