Non-destructive tester for single event burnout of power diodes-Reference-Cited by-同舟云学术

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Non-destructive tester for single event burnout of power diodes

Published:2001-09 Issue:9-10 Volume:41 Page:1725-1729
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Busatto G.,Iannuzzo F.,Velardi F.,Wyss J.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Electric-Field-Dependence Mechanism for Cosmic Ray Failure in Power Semiconductor Devices;IEEE Transactions on Electron Devices;2021-07

2. Failure Analysis of Heavy Ion-Irradiated Schottky Diodes;IEEE Transactions on Nuclear Science;2018-01

3. Schottky Diode Derating for Survivability in a Heavy Ion Environment;IEEE Transactions on Nuclear Science;2015-12

4. Single event burnout in power diodes: Mechanisms and models;Microelectronics Reliability;2006-02

5. Coupled electro-thermal Simulations of single event burnout in power diodes;IEEE Transactions on Nuclear Science;2005-12

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