Author:
ZHU Meng-jian,LI Shun,ZHAO Xun,XIONG De-gan
Subject
Materials Chemistry,Metals and Alloys,Geotechnical Engineering and Engineering Geology,Condensed Matter Physics
Reference22 articles.
1. Advanced electronic packaging materials: Advanced Materials and Processes [J];ZWEBEN;JOM,2005
2. Metal matrix composites: Current developments and future trends in industrial research and applications [M];TERRY,1990
3. Processing of Al–SiCp metal matrix composites by pressureless infiltration of SiC performs [J];PECH-CANUL;Journal of Materials Synthesis and Processing,2000
4. Fabrication process and thermal properties of SiCp/Al metal matrix composites for electronic packaging applications [J];LEE;Journal of Materials Science,2000
5. Ceramic and glass-ceramic packaging in the 1990s [J];TUMMALA;Journal of the American Ceramic Society,1991
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