Microstructure and properties of Al-Si/Al-SiCp bilayer composite for electronic packaging-Reference-Cited by-同舟云学术

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Microstructure and properties of Al-Si/Al-SiCp bilayer composite for electronic packaging

Published:2022-02-25 Issue:10 Volume:33 Page:7811-7823
ISSN:0957-4522
Container-title:Journal of Materials Science: Materials in Electronics
language:en
Short-container-title:J Mater Sci: Mater Electron

Author:

Zhou Wei,Wang Richu,Peng Chaoqun,Cai Zhiyong^ORCID

Funder

National Natural Science Foundation of China

China Postdoctoral Science Foundation

Natural Science Foundation of Hunan Province

Postdoctoral Science Foundation of Central South University

Science and Technology Program of Hunan Province

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Link

https://link.springer.com/content/pdf/10.1007/s10854-022-07932-4.pdf

Reference33 articles.

1. C. Zweben, JOM 50, 47–51 (1998). https://doi.org/10.1007/s11837-998-0128-6

2. X.C. Tong, Advanced Materials for Thermal Management of Electronic Packaging (Springer, New York, 2011), pp. 1–58

3. W. Sun, C. Duan, W. Yin, Compos. Struct. 236, 111856 (2020). https://doi.org/10.1016/j.compstruct.2020.111856

4. T. Lee, J. Lee, D. Lee, I. Jo, S.K. Lee, H.J. Ryu, J. Alloys Compd. 831, 154647 (2020). https://doi.org/10.1016/j.jallcom.2020.154647

5. R. Zare, H. Sharifi, M.R. Saeri, M. Tayebi, J. Alloys Compd. 801, 520–528 (2019). https://doi.org/10.1016/j.jallcom.2019.05.317

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