Thin QFP — the next generation high pincount surface mount challenge-Reference-Cited by-同舟云学术

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Thin QFP — the next generation high pincount surface mount challenge

Published:1993-05 Issue:3 Volume:24 Page:181-189
ISSN:0026-2692
Container-title:Microelectronics Journal
language:en
Short-container-title:Microelectronics Journal

Author:

Culver Robbyn,Groover Richard,Hamzehoost Ahmad,Huang Chin C.

Publisher

Elsevier BV

Subject

General Engineering

Reference4 articles.

1. Thin Outline Packages: Handle With Care;Iscoff,1992

2. Thin QFP Design and Development;Woosley,1992

3. Development of Ultra-thin Surface Mounting IC Package;Fujita,1990

4. Noda Y., “The Latest Moulding Technology for Fine Pitch P-QFP”, IEMT Symposium 91.

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Performance of a hybrid fine pitch quad flat package mounted with a new flux on printed circuit board in surface insulation resistance test;Materialwissenschaft und Werkstofftechnik;2020-10

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