Performance of a hybrid fine pitch quad flat package mounted with a new flux on printed circuit board in surface insulation resistance test-Reference-Cited by-同舟云学术

Performance of a hybrid fine pitch quad flat package mounted with a new flux on printed circuit board in surface insulation resistance test

Published:2020-10 Issue:10 Volume:51 Page:1353-1363
ISSN:0933-5137
Container-title:Materialwissenschaft und Werkstofftechnik
language:en
Short-container-title:Materialwiss. Werkstofftech.

Author:

Zhou D.¹,Haseeb A.S.M.A.¹,Andriyana A.¹,Wong Y.H.¹,Sabri M.F.M.¹,Low B.Y.²,Pang X.S.³,Eu P.L.²,Tan L.C.⁴

Affiliation:

1. Centre of Advanced Materials, Department of Mechanical Engineering, Faculty of Engineering University of Malaya KUALA LUMPUR 50603 MALAYSIA

2. Process Innovation, NXP Semiconductors Sdn Bhd SELANGOR MALAYSIA

3. Process Innovation NXP Semiconductors (China) Co. Ltd TIANJIN, PEOPLE'S REPUBLIC OF CHINA

4. Process Innovation NXP Semiconductors Singapore Pte Ltd, REPUBLIC OF SINGAPORE

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/mawe.202000064

Reference30 articles.

1. C. Cohn C. Harper Failure-Free Integrated Circuit Packages McGraw-Hill Professional Publishing 2004.

2. W. Greig Integrated circuit packaging assembly and interconnections Springer Science & Business Media 2007.

3. Thin QFP — the next generation high pincount surface mount challenge

4. Step aside QFP - here comes OMPAC

5. M.J. Kelly W.R. Boulton J. Kukowski G. Meieran M. Pecht J. Peeples R. Tummala M.J. Dehaemer G. Holdridge G. Gamota JTEC Panel report on electronic manufacturing and packaging in Japan 1995.

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