Influence on temperature distribution of COB deep UV LED due to different packaging density and substrate type-Reference-Cited by-同舟云学术

Influence on temperature distribution of COB deep UV LED due to different packaging density and substrate type

Published:2021-04 Issue: Volume:231 Page:166392
ISSN:0030-4026
Container-title:Optik
language:en
Short-container-title:Optik

Author:

Xia Zhenghao,Liang Shenghua,Li Bingqian,Wang Fei,Zhang Daming

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

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1. Development of Chip Temperature and Cost-Based Optimum Design for a Radial Heat Sink Cooling High Power LEDs;Bitlis Eren Üniversitesi Fen Bilimleri Dergisi;2023-12-28

2. Temperature Distribution Research on Liquid Packaging Structure of Deep UV LEDs;International Journal of Photoenergy;2023-11-20

3. Intelligent optimization design of electron barrier layer for AlGaN-based deep-ultraviolet light-emitting diodes;Acta Physica Sinica;2023

4. Improvement of thermal and optical behavior of multi-chip LEDs package;Case Studies in Thermal Engineering;2022-11

5. Recent Advances in Packaging Technologies of AlGaN‐Based Deep Ultraviolet Light‐Emitting Diodes;Advanced Materials Technologies;2022-03-03