Improvement of thermal and optical behavior of multi-chip LEDs package
Author:
Publisher
Elsevier BV
Subject
Fluid Flow and Transfer Processes,Engineering (miscellaneous)
Reference20 articles.
1. Thermal design and analysis of multi-chip LED module with ceramic substrate;Yin;Solid State Electron.,2010
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4. Multidisciplinary optimization of a pin-fin radial heat sink for LED lighting applications;Jang;Int. J. Heat. Mass Transf.,2012
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