In situ study the dependence of electrochemical migration of tin on chloride
Author:
Publisher
Elsevier BV
Subject
Electrochemistry
Reference11 articles.
1. Electrochemical migration of tin in electronics and microstructure of the dendrites
2. Irregular effect of chloride impurities on migration failure reliability: contradictions or understandable?
3. Effect of Ionization Characteristics on Electrochemical Migration Lifetimes of Sn-3.0Ag-0.5Cu Solder in NaCl and Na2SO4 Solutions
4. Influence of electrochemical properties on electrochemical migration of SnPb and SnBi solders
5. Characteristics of environmental factor for electrochemical migration on printed circuit board
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