Plasma reactor design for the selective etching of SiO2 on Si
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference10 articles.
1. Etching Characteristics of Silicon and its Compounds by Gas Plasma
2. 半導体集積回路製造工程へのガスプラズマの応用
3. Control of relative etch rates of SiO2 and Si in plasma etching
4. The effect of electro-negative gases on the work function of a metal
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