Electron and optical beam testing of integrated circuits using CIVA, LIVA, and LECIVA-Reference-Cited by-同舟云学术

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Electron and optical beam testing of integrated circuits using CIVA, LIVA, and LECIVA

Published:1996-02 Issue:1-4 Volume:31 Page:13-24
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Cole Edward I.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference14 articles.

1. Proc. Int. Rel. Phys. Symp.;Cole,1992

2. Int. Rel. Phys. Symp.;Cole,1994

3. Proc. Int. Symp. Testing and Failure Anal.;Cole,1994

4. Proc. Int. Symp. Testing and Failure Anal.;Wills,1990

5. Proc. Int. Rel. Phys. Symp.;Henley,1984

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Contactless Testing and Diagnosis Techniques;Advanced Circuits for Emerging Technologies;2012-05-07

2. Confocal optical beam induced current microscopy of light-emitting diodes with a white-light supercontinuum source;Applied Physics B;2007-08-22

3. Back side optical beam induced current method for the localization of electric field enhancements in edge termination structures of power semiconductor devices;Microelectronics Reliability;2000-08

4. Comparison of one- and two-photon optical beam-induced current imaging;Journal of Applied Physics;1999-08-15

5. Two-photon optical beam induced current imaging through the backside of integrated circuits;Applied Physics Letters;1997-11-03

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