Laser probing of thermal behaviour of electronic components and its application in quality and reliability testing-Reference-Cited by-同舟云学术

Laser probing of thermal behaviour of electronic components and its application in quality and reliability testing

Published:1994-03 Issue:1-4 Volume:24 Page:411-420
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Claeys W.,Dilhaire S.,Quintard V.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference7 articles.

1. Joule displacement and thermoelastic optical test probe for electronic components;Claeys;ESREF 91,1991

2. Thermoreflectance optical test probe for the measurement of current-induced temperature changes in microelectronic components;Claeys;Quality and Reliability Engineering International,1993

3. Spatially resolved measurements of current induced temperature changes in microelectronic components from a thermoreflectance optical test probe;Claeys;Proceedings of ESREF 92,1992

4. Absolute dynamic measurements of temperature changes in electronic components from a thermoreflectance optical test probe;Claeys;IEEE Conf. ETC 93,1993

5. Thermal and plasma wave depth profiling in silicon;Opsal;Appl Phys Letters,1985

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