Thermal microscopy of electronic materials

Author:

Heiderhoff Ralf,Makris Andreas,Riedl Thomas

Funder

Deutsche Forschungsgemeinschaft (DFG)

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference143 articles.

1. Thermal materials solve power electronics challenges;Zweben;Power Electron. Technol.,2006

2. DETHERM, 2015. 〈http://www.dechema.de/Detherm.html〉 (accessed October 9, 2015).

3. Emerging challenges and materials for thermal management of electronics;Moore;Mater. Today,2014

4. Review and projections of integrated cooling systems for three-dimensional integrated circuits;Kandlikar;J. Electron. Packag.,2014

5. F.L. Tan, S.C. Fok, Thermal management of mobile phone using phase change material, 2007 9th Electronic Packaging Technology Conference, vols 1–2, 2007, pp. 836–842. Doi:10.1109/EPTC.2007.4469773.

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