Properties of interfaces in Cu/Ti1−xAlxN/〈Si〉 multilayers
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry
Reference23 articles.
1. Tantalum‐based diffusion barriers in Si/Cu VLSI metallizations
2. Interdiffusions and reactions in Cu/TiN/Ti/Si and Cu/TiN/Ti/SiO2/Si multilayer structures
3. Electrical characteristics of TiN contacts toNsilicon
4. Influence of the nitrogen partial pressure on the properties of d.c.-sputtered titanium and titanium nitride films
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2. Influence of niobium ion implantation on the microstructure, mechanical and tribological properties of TiAlN/CrN nano-multilayer coatings;Surface and Coatings Technology;2014-02
3. Study of the microstructure and tribological properties of Mo+C-implanted TiN coatings on cemented carbide substrates;Surface and Coatings Technology;2013-08
4. Multi-functional nano-multilayered AlTiN/Cu PVD coating for machining of Inconel 718 superalloy;Surface and Coatings Technology;2010-04
5. Microstructure and physical properties of arc ion plated TiAlN/Cu thin film;Surface and Coatings Technology;2006-12
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