Influence of Ti addition on the properties of W–Ti–C/N sputtered films
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry
Reference37 articles.
1. Barrier layers: Principles and applications in microelectronics
2. On the microstructure-property relationship of WTi(N) diffusion barriers
3. Particle contamination during sputter deposition of W–Ti films
4. Columnar microstructures in magnetron-sputtered refractory metal thin films of tungsten, molybdenum and W-Ti-(N)
5. Evaluation of in situ formed W–Ti and MoSi2 as a diffusion barrier to Al for CoSi2 silicided contact
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