Particle contamination during sputter deposition of W–Ti films-Reference-Cited by-同舟云学术

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Particle contamination during sputter deposition of W–Ti films

Published:1992-07 Issue:4 Volume:10 Page:1713-1717
ISSN:0734-2101
Container-title:Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films
language:en
Short-container-title:Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films

Author:

Wickersham C. E.,Poole J. E.,Mueller J. J.

Publisher

American Vacuum Society

Subject

Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics

Link

http://avs.scitation.org/doi/pdf/10.1116/1.577775

Cited by 18 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. W-Ti refractory alloy with high hardness forged using dynamic pressure-assisted hot pressing;International Journal of Refractory Metals and Hard Materials;2023-08

2. Influence of sintering temperature on microstructure and properties of 90W-10Ti alloy targets prepared by hot oscillating pressing;Vacuum;2023-04

3. Fast in-situ repair technology-a novel SPS process for the waste refractory W–10Ti targets;Vacuum;2021-10

4. Sinter-joining of W-10Ti powder to W-10Ti waste target by spark plasma sintering;Materials Today Communications;2021-06

5. Spark plasma sintering of W-10Ti alloys: microstructure, properties and grain growth kinetics;Materials Research Express;2021-04-01

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