A coating thickness uniformity model for physical vapour deposition systems: further analysis and development-Reference-Cited by-同舟云学术

A coating thickness uniformity model for physical vapour deposition systems: further analysis and development

Published:1998-06 Issue:1-2 Volume:105 Page:76-83
ISSN:0257-8972
Container-title:Surface and Coatings Technology
language:en
Short-container-title:Surface and Coatings Technology

Author:

Fancey Kevin S

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry

Reference8 articles.

1. A coating thickness uniformity model for physical vapour deposition systems: overview

2. H.R. Smith, in: Proc. 12th Ann. Tech. Conf. of the Society of Vacuum Coaters (Detroit, MI, 1969), Society of Vacuum Coaters, Cleveland, OH, 1969, p. 50.

3. The influence of process system characteristics on the uniformity of ion plated titanium nitride coatings

4. Ion plating processes: Design criteria and system optimization

5. Coating thickness fall-off with source to substrate distance in PVD processes

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