Author:
Zhong Ping,Wang Shile,Jin Ye,Tu Xinxing,Luo Nian
Funder
Key Basic Research Foundation of Science and Technology Commission of Shanghai Municipality
Subject
Computational Mathematics,Computational Theory and Mathematics,Modeling and Simulation
Reference13 articles.
1. Moiré interferometry for engineering mechanics: current practices and future developments;Han;The Journal of Strain Analysis for Engineering Design,2001
2. Lei Han, Jue Zhong, Arkady Voloshin, Image analysis and data processing of time series fringe pattern of PCBs by using moiré interferometry, in: Proceedings of HDP’04, 2004, pp. 141–145.
3. Wei Tan, I.Charles Ume, Effects of warpage on fatigue reliability of solder bumps: experimental and analytical studies, in: Electronic Components and Technology Conference, 2008, pp. 131–138.
4. Wei Tan, I.Charles Ume, Warpage measurement of board assemblies using projection moiré system with improved automatic image segmentation algorithm, in: Electronic Components and Technology Conference, 2006, pp. 607–613.
5. Reinhard E. Powell, I. Charles Ume, Simultaneous measurement of PWB and chip package warpage using the projection moiré technique and automatic image segmentation, in: Electronic Components and Technology Conference, 2007, pp. 1769–1774.
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