Coupled simulation of transient heat flow and electric currents in thin wires: Application to bond wires in microelectronic chip packaging
Author:
Funder
European Union
Technische Universität Darmstadt
Publisher
Elsevier BV
Subject
Computational Mathematics,Computational Theory and Mathematics,Modelling and Simulation
Reference39 articles.
1. Calculation and experimental validation of induced currents on coupled wires in an arbitrary shaped cavity;Umashankar;IEEE Trans. Antennas and Propagation,1987
2. Thin wire representation in finite difference time domain surge simulation;Noda;IEEE Trans. Power Deliv.,2002
3. Efficient finite element electromagnetic modeling of thin wires;Wu;Microw. Opt. Tech. Lett.,2008
4. Differentiable Manifolds;De Rham,1984
5. De Rham currents in discrete electromagnetism;Auchmann;COMPEL,2007
Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Liquid metal/metal porous skeleton with high thermal conductivity and stable thermal reliability;Journal of Materials Science;2023-12
2. Evolution Laws of Microstructure and Properties of Pt-10Ir Ultrafine Bonding Wire During Annealing;RARE METAL MAT ENG;2023
3. Simulation Model of Temperature Multi Field Coupling in Electrochemical Machining using Computer VR Technology;2023 2nd International Conference on Artificial Intelligence and Autonomous Robot Systems (AIARS);2023-07
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3