Rheological and thermal properties of dough and textural and microstructural features of bread obtained from nixtamalized corn/wheat flour blends
Author:
Publisher
Elsevier BV
Subject
Biochemistry,Food Science
Reference30 articles.
1. Effect of viscoelasticity on foam development in zein-starch dough;Berta;LWT-Food Sci. Tech.,2015
2. Maize-based gluten-free bread: influence of processing parameters on sensory and instrumental quality;Brites;Food Bioproc. Technol.,2010
3. Significance of thermal transitions on starch digestibility and firming kinetics of restricted water mixed flour bread matrices;Collar;Carbohyd. Polym.,2015
4. Effect of NaCl on the thermal behaviour of wheat starch in excess and limited water;Day;Carbohydr. Polym.,2013
5. Kinetics of crust formation during conventional French bread baking;Della Valle;J. Cereal Sci.,2012
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