Measurement of fracture toughness of copper via constant-load microscratch with a spherical indenter-Reference-Cited by-同舟云学术

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Measurement of fracture toughness of copper via constant-load microscratch with a spherical indenter

Published:2020-03 Issue: Volume:444-445 Page:203158
ISSN:0043-1648
Container-title:Wear
language:en
Short-container-title:Wear

Author:

Zhang Dong,Sun Yuan,Gao Chenghui,Liu Ming

Funder

National Natural Science Foundation of China

Engineering Research Center for CAD/CAM of Fujian Provincial Colleges and Universities

Plateau Disciplines in Shanghai

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,Condensed Matter Physics

Reference125 articles.

1. Microscratch analysis of the work of adhesion for Pt thin-films on NiO;Venkataraman;J. Mater. Res.,1992

2. Nanoindentation, microscratch, friction and wear studies of coatings for contact recording applications;Bhushan;Wear,1995

3. Material removal mechanisms of single-crystal silicon on nanoscale and at ultralow loads;Zhao;Wear,1998

4. Nanomechanical and nanotribological testing of ultra-thin carbon-based and MoST films for increased MEMS durability;Beake;J. Phys. D Appl. Phys.,2009

5. A comparative study of the nanoscratching behavior of amorphous carbon films grown under various deposition conditions;Charitidis;Surf. Coat. Technol.,2000

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