Surface formation, morphology, integrity and wire marks in diamond wire slicing of mono-crystalline silicon in the photovoltaic industry

Author:

Qiu JianORCID,Li Xiaofei,Ge Renpeng,Liu Chongning

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,Condensed Matter Physics

Reference72 articles.

1. A Review Of Diamond Wire Wafering Technology At Meyer Burger Ltd;Heiber,2011

2. Effect of debris on the silicon wafering for solar cells;Bidiville;Sol. Energy Mat. Sol. C.,2011

3. Diamond wire sawing of solar silicon wafers: a sustainable manufacturing alternative to loose abrasive slurry sawing;Kumar;Procedia Manuf.,2018

4. Basic Mechanisms and models of multi-wire sawing;Möller;Adv. Eng. Mater.,2004

5. Mechanisms of wafer sawing and impact on wafer properties;Bidiville;Prog. Photovolt.,2010

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3. Modeling and experiment of material removal rate for cutting single-crystal silicon by electrical discharge wire sawing;The International Journal of Advanced Manufacturing Technology;2024-06-21

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