Experimental and numerical analysis of scratching induced damage during diamond wire sawing of silicon

Author:

Wallburg Florian,Kuna Meinhard,Budnitzki Michael,Schoenfelder Stephan

Funder

European Union as part of the ESF-Program

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,Condensed Matter Physics

Reference61 articles.

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3. Characterization of polycrystalline silicon wafers for solar cells sliced with novel fixed-abrasive wire;Watanabe;Prog. Photovolt., Res. Appl.,2010

4. Comprehensive analysis of strength and reliability of silicon wafers and solar cells regarding their manufacturing processes;Kaule;Photovolt. Int.,2015

5. Effect of crystal defects on mechanical properties relevant to cutting of multicrystalline solar silicon;Wu;Mater. Sci. Semicond. Process.,2013

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