Tribological behavior of 6H–SiC wafers in different chemical mechanical polishing slurries-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Tribological behavior of 6H–SiC wafers in different chemical mechanical polishing slurries

Published:2021-05 Issue: Volume:472-473 Page:203649
ISSN:0043-1648
Container-title:Wear
language:en
Short-container-title:Wear

Author:

Zhang Qixiang^ORCID,Pan Jisheng^ORCID,Zhang Xiaowei,Lu Jiabin,Yan Qiusheng

Funder

Guangdong Province Department of Education

Guangdong Provincial Natural Science Foundation

National Natural Science Foundation of China

Foshan Municipal Science and Technology Office

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,Condensed Matter Physics

Reference29 articles.

1. Wet etching of GaN, AlN, and SiC: a review;Zhuang;Mater. Sci. Eng. R Rep.,2005

2. Material science and device physics in SiC technology for high-voltage power devices;Kimoto;Jpn. J. Appl. Phys.,2015

3. Fundamentals of Silicon Carbide Technology: Growth, Characterization, Devices and Applications;Kimoto,2014

4. Chemical mechanical polishing: theory and experiment;Zhao;Friction,2013

5. Fundamental tribological and removal rate studies of inter-layer dielectric chemical mechanical planarization;Philipossian;Jpn. J. Appl. Phys.,2003

Cited by 32 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. New skin corrosion effect of magnetorheological electro-Fenton polishing investigated by friction and wear experiments;Materials Science in Semiconductor Processing;2024-12

2. Quantitative analysis of the polishing performance of Wurtzite-SiC surface texture on surface quality and material removal rate;Tribology International;2024-11

3. Preparation of SiO2@MnO2 composite abrasives and their performance in chemical-mechanical polishing of SiC substrates;Ceramics International;2024-10

4. Photocatalytic assisted chemical mechanical polishing for silicon carbide using developed ceria coated diamond core-shell abrasives;Tribology International;2024-09

5. Addition of Transition Metal Ion CMP Slurry for Forming Ultra-Flat SiC Crystal;Solid State Phenomena;2024-08-22

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3