Tool wear characteristics and their effects on nanoscale ductile mode cutting of silicon wafer
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,Condensed Matter Physics
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4. Chip topography for ductile-regime machining of germanium;Blackley;ASME Trans., J. Eng. Ind.,1994
5. Diamond cutting of silicon with nanometric finish;Fang;Ann. CIRP,1998
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