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On machining rate of hydrodynamic polishing process

  • Published:1995-09 Issue:1-2 Volume:188 Page:77-87
  • ISSN:0043-1648
  • Container-title:Wear
  • language:en
  • Short-container-title:Wear

Author:

Su Yaw-Terng,Wang Shuh-Yi,Hsiau Jar-Sian

Publisher

Elsevier BV

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,Condensed Matter Physics

Reference20 articles.

1. Tribology from a viewpoint of ultraprecision polishing technology;Kasai;Jpn. J. Tribol.,1992

2. Newly developed fully automatic polishing machining machines for obtainable super-smooth surfaces of compound semiconductor wafers;Kasai;Ann. CIRP,1988

3. Floating-polishing process and analysis of float-polished quartz;Soares;Appl. Opt.,1994

4. Practical uses of the surface energy criterion;Rabinowicz;Wear,1964

5. Mechanisms of abrasive polishing;Aghan;Wear,1970

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